| 发明名称 |
COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES |
| 摘要 |
A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone. |
| 申请公布号 |
EP2714807(A4) |
申请公布日期 |
2014.11.19 |
| 申请号 |
EP20120792059 |
申请日期 |
2012.05.31 |
| 申请人 |
BASF SE |
发明人 |
RÖGER-GÖPFERT, CORNELIA;ARNOLD, MARCO;FLÜGEL, ALEXANDER;EMNET, CHARLOTTE;RAETHER, ROMAN, BENEDIKT;MAYER, DIETER |
| 分类号 |
C25D3/38;C08G73/02;C08L79/02;C23C18/38;C25D7/12 |
主分类号 |
C25D3/38 |
| 代理机构 |
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代理人 |
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| 地址 |
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