| 摘要 |
<p>A computing center module with a module casing and a module area in which electronic devices are arrangeable, at least one access path being provided in the module area. The module area has a hot air outlet region, and the module casing tapers towards the hot air outlet region such that a natural cooling process is allowed. The computing center module is easily and inexpensively produced, requires little surface area, can be cooled efficiently and inexpensively, and offers the possibility to scale the provided module area as needed in a simple manner and to protect against specific environmental risks. The module casing is formed by a pipe which is closeable at the axial ends, and the module casing is provided with at least one movable coupling device for connecting to another computing center module casing such that a common module area is produced when the module casings are connected.</p> |
