Electronic apparatus with heat dissipation module

摘要

An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.

主权项

1. An electronic apparatus comprising:
a chassis comprising a first panel; a second panel, substantially parallel to the first panel; and a motherboard, attached on the first panel and located between the first panel and the second panel; and a heat dissipation module, attached on the motherboard, comprising a fan with a cover; a first fin assembly, attached to a first side of the fan; and a second fin assembly attached to a second side of the fan; the first side being substantially perpendicular and adjacent to the second side; and the cover comprising a main plate with an opening, defined therein, and a resisting flange, extending slantwise from an edge of the opening; wherein a portion of the first fin assembly is exposed by the opening, and the resisting flange is resisted against the second panel to keep the main plate away from the second panel.