| 发明名称 | Analysis device and method for analyzing a thermoforming process in a thermoforming laminating device | ||
| 摘要 | The present invention relates to an analysis device (10) for analyzing a thermoforming process in a thermoforming laminating device (20), wherein the analysis device (10) comprises a pressure housing (17) having a pressure resistance of up to 5 bar. At least one image recording device (12) that is connected to a data storage device (13) and one lighting device (11) is disposed in the pressure housing. A lens (12′) of the image recording device (12) is disposed adjacent to a light outlet opening (11) of the lighting device (11) in a housing wall of the housing (17), and the analysis device (10) comprises a temperature resistance of at least up to 50° C. The invention further relates to an analysis method for analyzing thermoforming processes in a thermoforming laminating device that can be performed by means of the analysis device (10) according to the invention. | ||
| 申请公布号 | US8890949(B2) | 申请公布日期 | 2014.11.18 |
| 申请号 | US201013379137 | 申请日期 | 2010.06.21 |
| 申请人 | Renolit SE | 发明人 | Held Lothar;Hayer Sascha |
| 分类号 | H04N7/18;B29C51/46;B29C51/10 | 主分类号 | H04N7/18 |
| 代理机构 | Strain & Strain PLLC | 代理人 | Strain, Esq. Paul D.;Strain & Strain PLLC |
| 主权项 | 1. An analysis device for analyzing a thermoforming process in a thermoforming laminating device, wherein the analysis device is disposed in the thermoforming laminating device and comprises a pressure housing having a pressure resistance of up to 5 bar in which at least one image recording device connected to a data storage device and one lighting device are disposed, wherein a lens of the image recording device is disposed adjacent to a light outlet opening of the lighting device on a housing wall of the housing, and wherein the analysis device has a temperature resistance of at least up 50° C. | ||
| 地址 | Worms DE | ||