发明名称 |
Polysilicon design for replacement gate technology |
摘要 |
The present disclosure provides an integrated circuit. The integrated circuit includes a semiconductor substrate; and a passive polysilicon device disposed over the semiconductor substrate. The passive polysilicon device further includes a polysilicon feature; and a plurality of electrodes embedded in the polysilicon feature. |
申请公布号 |
US8890260(B2) |
申请公布日期 |
2014.11.18 |
申请号 |
US200912554604 |
申请日期 |
2009.09.04 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chuang Harry Hak-Lay;Thei Kong-Beng;Chung Sheng-Chen;Yeh Chiung-Han;Teo Lee-Wee;Hsu Yu-Ying;Young Bao-Ru |
分类号 |
H01L29/78;H01L27/06;H01L27/092;H01L29/66;H01L21/8238;H01L49/02 |
主分类号 |
H01L29/78 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. An integrated circuit, comprising:
a semiconductor substrate; and a passive polysilicon device disposed over the semiconductor substrate, the passive polysilicon device including:
a conductive layer formed over the semiconductor substrate and formed of a conductive material;a polysilicon feature formed on the conductive layer and formed of a polysilicon material, the polysilicon material being different than the conductive material;a sidewall spacer disposed along a sidewall of the polysilicon feature and a sidewall of the conductive layer; anda plurality of electrodes embedded in the polysilicon feature, wherein a portion of the polysilicon feature extends from an edge of one of the plurality of electrodes to the sidewall spacer, wherein the edge faces the sidewall spacer. |
地址 |
Hsin-Chu TW |