发明名称 Polysilicon design for replacement gate technology
摘要 The present disclosure provides an integrated circuit. The integrated circuit includes a semiconductor substrate; and a passive polysilicon device disposed over the semiconductor substrate. The passive polysilicon device further includes a polysilicon feature; and a plurality of electrodes embedded in the polysilicon feature.
申请公布号 US8890260(B2) 申请公布日期 2014.11.18
申请号 US200912554604 申请日期 2009.09.04
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chuang Harry Hak-Lay;Thei Kong-Beng;Chung Sheng-Chen;Yeh Chiung-Han;Teo Lee-Wee;Hsu Yu-Ying;Young Bao-Ru
分类号 H01L29/78;H01L27/06;H01L27/092;H01L29/66;H01L21/8238;H01L49/02 主分类号 H01L29/78
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. An integrated circuit, comprising: a semiconductor substrate; and a passive polysilicon device disposed over the semiconductor substrate, the passive polysilicon device including: a conductive layer formed over the semiconductor substrate and formed of a conductive material;a polysilicon feature formed on the conductive layer and formed of a polysilicon material, the polysilicon material being different than the conductive material;a sidewall spacer disposed along a sidewall of the polysilicon feature and a sidewall of the conductive layer; anda plurality of electrodes embedded in the polysilicon feature, wherein a portion of the polysilicon feature extends from an edge of one of the plurality of electrodes to the sidewall spacer, wherein the edge faces the sidewall spacer.
地址 Hsin-Chu TW