发明名称 Film forming system and method using application nozzle
摘要 According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.
申请公布号 US8887657(B2) 申请公布日期 2014.11.18
申请号 US201012795259 申请日期 2010.06.07
申请人 Kabushiki Kaisha Toshiba;Chugai Ro Co., Ltd. 发明人 Ooshiro Kenichi;Sato Tsuyoshi;Tokumoto Takao;Natsu Sadao;Iwasaki Souichirou
分类号 B05C11/08;B05B5/00;B05B3/04;H01L21/67;B05B15/02;B05B12/08;B41J2/165;B05C5/02;B05D1/00 主分类号 B05C11/08
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A film forming system comprising: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism configured to rotate the stage in a rotational direction along the placement surface; an application nozzle configured to discharge a material onto the object placed on the stage for application; a moving mechanism configured to relatively move the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller configured to perform a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; a cleaning apparatus configured to clean the application nozzle; and an image acquiring unit configured to acquire an image of the application nozzle discharging the material to the object placed on the stage during application of the material to the object, the image acquiring unit being placed on an upstream side of the application nozzle in a rotating direction of the stage, wherein the controller judges a degree of excess material collected on an outside of the application nozzle based on the image on the upstream side of the application nozzle acquired by the image acquiring unit, and the controller is configured to perform at least one of stopping application of the material to the object, adjustment of an amount of the material discharged from the application nozzle, or adjustment of a gap between the application nozzle and the object based on the controller judging presence of a collection of the excess material on the outside of the application nozzle, when the controller judges a width of the excess material or a height of the excess material from a bottom surface of the application nozzle is more than a predetermined threshold value, or when the controller determines images of a tip of the application nozzle obtained at each predetermined time are compared and a fluctuation range of the excess material exceeds a predetermined threshold value.
地址 Tokyo JP