Wafer level camera module with active optical element

摘要

A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.

主权项

1. A wafer level camera module comprising:
an electrically controllable active optical element; an electrical conduction path from the active optical element to a mounting surface of the camera module, said electrical conduction path being configured to provide electrical contact between said active optical element and said mounting surface; a surface conductor located on said mounting surface of the camera module, the surface conductor being in electrical contact with said electrical conduction path and being configured to make electrical contact with a conductive path on a host substrate to which the camera module is mounted, the surface conductor being part of a first group of surface conductors for the active optical element; a second group of surface conductors arranged to be substantially co-planar with the first group of surface conductors; and a housing for receiving and containing elements of said camera module upon assembly thereof, said housing being operative to ensure proper relative positioning between said the first group of surface conductors and the second group of surface conductors.