发明名称 Horn antenna for a radar device
摘要 A horn antenna for a radar device including a dielectric filling body arranged in a hollow horn section of a metal body and a dielectric cover attached to the filling body and sealingly closing the open end of the metal body. The filling body includes a first conical portion that is fittingly received in the hollow horn section, and a second conical portion that is situated away from the open end and dimensioned to leave a gap between itself and the wall of the hollow horn section. The dielectric filling body has a third portion between the first and second portions, where the third portion and the opposite portion of the wall of the hollow horn section are provided with circumferential grooves arranged in pairs opposite each other to provide a wear and maintenance-free attachment of the dielectric filling body in the horn antenna.
申请公布号 US8890759(B2) 申请公布日期 2014.11.18
申请号 US201213655829 申请日期 2012.10.19
申请人 Siemens Aktiengesellschaft 发明人 Pantea Valentin;Serban Mihai-Gabriel;Singh Baljinder
分类号 H01Q13/00;H01Q19/08;G01F23/284;H01Q13/02;H01Q1/22 主分类号 H01Q13/00
代理机构 Cozen O'Connor 代理人 Cozen O'Connor
主权项 1. A horn antenna for a radar device comprising: a metal body having a hollow horn section which expands to an open end in the metal body; a dielectric filling body arranged in the hollow horn section and having a first conical portion situated towards the open end of the metal body and fittingly received in the hollow horn section, a second conical portion situated away from the open end and dimensioned to leave a gap between itself and a wall of the hollow horn section, and a third portion between said first and second portions; a dielectric cover attached to the dielectric filling body and sealingly closing the open end of the metal body; and circumferential grooves arranged in pairs opposite each other provided in the third portion and in an opposite portion of the wall of the hollow horn section, the circumferential grooves being filled with a cured encapsulation material which is one of dielectric and conductive; wherein a depth of the circumferential grooves in the metal body is one of constant and increases with increasing distance from the open end of the metal body if the encapsulation material is dielectric; and wherein a depth of the circumferential grooves in the dielectric filling body is one of constant and increases with increasing distance from the open end of the metal body if the encapsulation material is conductive.
地址 Munich DE