| 发明名称 | TCP-type semiconductor device and method of testing thereof | ||
| 摘要 | A semiconductor device includes a base film, a semiconductor chip mounted on the base film, and a plurality of leads formed on the base film, each of the leads including one end coupled to the semiconductor chip and another end being opposite to the one end. The another end of a first one of the leads and the another end of a second one of the leads are located at different positions respectively between the semiconductor chip and a cut line along which the base film is cut. | ||
| 申请公布号 | US8890561(B2) | 申请公布日期 | 2014.11.18 |
| 申请号 | US201213365508 | 申请日期 | 2012.02.03 |
| 申请人 | Renesas Electronics Corporation | 发明人 | Sasaki Suguru |
| 分类号 | G01R31/26;H01L23/495;G01R31/28;H01L23/00 | 主分类号 | G01R31/26 |
| 代理机构 | McGinn IP Law Group, PLLC | 代理人 | McGinn IP Law Group, PLLC |
| 主权项 | 1. A semiconductor device, comprising: a base film; a semiconductor chip mounted on the base film; and a plurality of leads formed on the base film, each of the leads including one end coupled to the semiconductor chip and another end being opposite to the one end, wherein the another end of a first one of the leads and the another end of a second one of the leads are located at different positions respectively between the semiconductor chip and a cut line along which the base film is cut. | ||
| 地址 | Kawasaki-Shi, Kanagawa JP | ||