Test head and semiconductor wafer test apparatus comprising same

摘要

Providing a test head capable of suppressing a probe card from bending.;The test head 40 comprises: a test head main body 51 having a frame 51; an interface apparatus 60 electrically connecting a probe card 20 and the test head main body 50 with each other; and a brake unit 80 positioned between the probe card 20 and the frame 51 to transmit a pressing force F applied to the probe card 20 to the frame 51.

主权项

1. A test head comprising:
a test head main body having a frame; and an interface apparatus electrically connecting a probe card and the test head main body with each other and a stiffener that reinforces the probe card, wherein the test head further comprises: a transmitter positioned between the probe card and the frame and configured to transmit a pressing force applied to the probe card to the frame; a holding mechanism provided at a top plate of the interface apparatus and configured to hold the probe card; and a limiter provided at the top plate and configured to limit a movement of the holding mechanism in a direction departing from the probe card reinforced by the stiffener, wherein the transmitter has: a contact member being movable relative to either one of the limiter or the frame and contacting other of the limiter or the frame; and a lock mechanism provided at either one of the limiter or the frame and configured to lock a relative movement of the contact member.