Integrated circuit package and method of forming the same

摘要

An integrated circuit package includes an electronic sensor protected by a lid structure. The electronic sensor includes a transducer placed on a backside surface of a lead frame assembly. The lid structure is placed over the transducer and is attached to the lead frame assembly on the backside surface. The lid can define an air cavity around the transducer, such that mold compound, gel, or other protective chemical material is not placed in contact with the transducer. The transducer is therefore protected without a chemical protectant, lowering the cost of the integrated circuit package and maintaining the sensitivity and performance of the transducer.

主权项

1. An electronic device comprising:
a lead frame assembly including a lead frame, the lead frame assembly having a horizontal plane defined by a first major surface, and a second major surface opposite the first major surface; an opening between the first major surface and the second major surface; a transducer attached to the first major surface over the opening; a lid structure attached to the first major surface to cover the transducer; and leads of the lead frame, non-horizontal surfaces of the leads extend in a direction away from the first major surface and opposite to the second major surface and in a same direction as non-horizontal surfaces of the transducer and non-horizontal surfaces of the lid structure extend away from the first major surface and the second major surface.