发明名称 |
Airgap structure and method of manufacturing thereof |
摘要 |
A process for fabricating a gate structure, the gate structure having a plurality of gates defined by a network of spaces. The word line (WL) spaces within a dense WL region having airgaps and those spaces outside of the dense WL being substantially free of airgaps. A gate structure having a silicide layer dispose across the plurality of gates is also provided. |
申请公布号 |
US8890254(B2) |
申请公布日期 |
2014.11.18 |
申请号 |
US201213617643 |
申请日期 |
2012.09.14 |
申请人 |
Macronix International Co., Ltd. |
发明人 |
Huang Yu-Fong;Chan Kun-Mou;Han Tzung-Ting |
分类号 |
H01L21/70;H01L29/788;H01L21/336;H01L21/3205 |
主分类号 |
H01L21/70 |
代理机构 |
Alston & Bird LLP |
代理人 |
Alston & Bird LLP |
主权项 |
1. A method of fabricating a gate structure comprising:
providing a gate structure assembly having a plurality of gates disposed across a substrate defined by a network of spaces, the gate structure assembly defined by a dense word line (WL) region; applying a deposition layer to form void spaces in any space of the dense WL region; forming a first interlayer dielectric across the gate structure; removing a cap layer disposed on the gate structure to form openings in the void spaces; constructing a silicide layer on the plurality of gates; and forming a second interlayer dielectric across the plurality of gates, wherein the second interlayer dielectric comprises a buffer oxide layer, silicon nitride film, and at least one of a silicon oxide layer and an undoped silicon glass layer. |
地址 |
Hsin-Chu TW |