Printed wiring board having through-hole and a method of production thereof

摘要

A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

主权项

1. A printed wiring board, comprising: an insulating resin substrate having a penetrating-hole formed through the insulating resin substrate such that the penetrating-hole is extending from a first surface to a second surface of the insulating resin substrate; a first conductor layer formed on the first surface of the insulating resin substrate and including a first through-hole land; a second conductor layer formed on the second surface of the insulating resin substrate and including a second through-hole land; and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and connecting the first through-hole land of the first conductor layer and the second through-hole land of the second conductor layer such that the first and second through-hole lands are formed on end portions of the through-hole conductor structure, respectively, wherein the penetrating-hole has a first opening portion, a second opening portion and a neck portion connecting the first opening portion and the second opening portion, the first opening portion has a first opening on the first surface and a first sidewall extending from the first opening toward the second surface, the second opening portion has a second opening on the second surface and a second sidewall extending from the second opening toward the first surface, the first opening portion and the second opening portion are positioned such that the first opening portion and the second opening portion are out of alignment with respect to each other and that the neck portion defined by an intersection of the first side wall and the second side wall is not parallel to at least one of the first surface and second surface of the insulating resin substrate, and the through-hole conductor structure and the first and second through-hole lands comprise an electrolytic plated film formed in the penetrating-hole and extending out the penetrating-hole onto the first and second surfaces of the insulating resin substrate.