发明名称 Methods for forming composite housing frames
摘要 Electronic device frames may be formed from fiber composites. Carbon fiber material may be formed into frame members using pultrusion tools. Notches may be machined into the frame members. The machined frame members may be assembled to form a rectangular frame assembly using lap joints. Fiber tape may be wound around the periphery of the frame assembly. Following curing, additional parts such as a metal blank may be bonded to the frame assembly and machined.
申请公布号 US8888940(B2) 申请公布日期 2014.11.18
申请号 US201113049093 申请日期 2011.03.16
申请人 Apple Inc. 发明人 DiFonzo John C.;Kenney Kevin;Garelli Adam T.;Ligtenberg Christiaan A.
分类号 B29C70/84;B29C53/56;B29C65/00;B29C70/52;B29C70/86;B29L31/34;B29K307/04;B29C70/54;B29C65/48;B29L12/00 主分类号 B29C70/84
代理机构 Brownstein Hyatt Farber Schreck, LLP 代理人 Brownstein Hyatt Farber Schreck, LLP
主权项 1. A method for forming an electronic device frame, comprising: forming frame members; assembling the frame members to form a rectangular frame assembly for an electronic device; and with a winding tool, winding fiber tape around the rectangular frame assembly, wherein the fiber tape is formed from a continuous piece of binder preimpregnated tape wrapped around the winding tool.
地址 Cupertino CA US