| 发明名称 | Laminated-type electronic component | ||
| 摘要 | A laminated-type electronic component including: plural magnetic material layers; plural conductive patterns; a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns; a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and at least one magnetic gap formed in the laminated layer body, wherein the magnetic gaps are formed of a compound of Ni and Cu. | ||
| 申请公布号 | US8890646(B2) | 申请公布日期 | 2014.11.18 |
| 申请号 | US201313861507 | 申请日期 | 2013.04.12 |
| 申请人 | Toko, Inc. | 发明人 | Noguchi Yutaka;Yamamoto Makoto;Maeda Satoru |
| 分类号 | H01F5/00;H01F27/28;H01F17/00;H01F3/14 | 主分类号 | H01F5/00 |
| 代理机构 | Renner, Kenner, Greive, Bobak, Taylor & Weber | 代理人 | Renner, Kenner, Greive, Bobak, Taylor & Weber |
| 主权项 | 1. A laminated-type electronic component comprising: plural magnetic material layers; plural conductive patterns; a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns; a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and at least one magnetic gap formed in the laminated layer body, wherein the magnetic material layers are formed of a ferrite including Ni, and the at least one magnetic gap is formed of a compound consisting of Ni and Cu not including Zn and Fe. | ||
| 地址 | Tsurugashima-Shi, Saitama-Ken JP | ||