| 发明名称 | Thermal interface for multi-chip packages | ||
| 摘要 | A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP). | ||
| 申请公布号 | US8891235(B2) | 申请公布日期 | 2014.11.18 |
| 申请号 | US201213539279 | 申请日期 | 2012.06.29 |
| 申请人 | Intel Corporation | 发明人 | Walczyk Joseph F.;Yang Jin;Maveety James G.;Albertson Todd P.;Gupta Ashish;Pan Jin;Krishnamoorthy Arun |
| 分类号 | H05K7/20;F28F9/007 | 主分类号 | H05K7/20 |
| 代理机构 | Blakely, Sokoloff, Taylor & Zafman LLP | 代理人 | Blakely, Sokoloff, Taylor & Zafman LLP |
| 主权项 | 1. A thermal interface unit, comprising: a pedestal; a first contact surface below the pedestal to interface with a first die; and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP). | ||
| 地址 | Santa Clara CA US | ||