发明名称 |
Chip to package interface |
摘要 |
In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip disposed within an encapsulant, and a first coil disposed in the semiconductor chip. A dielectric layer is disposed above the encapsulant and the semiconductor chip. A second coil is disposed above the dielectric layer. The first coil is magnetically coupled to the second coil. |
申请公布号 |
US8890319(B2) |
申请公布日期 |
2014.11.18 |
申请号 |
US201213612547 |
申请日期 |
2012.09.12 |
申请人 |
Infineon Technologies AG |
发明人 |
Sapone Giuseppina |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A semiconductor package comprising:
a semiconductor chip disposed within an encapsulant; a first coil disposed in the semiconductor chip; a dielectric layer disposed above the encapsulant and the semiconductor chip; a second coil disposed above the dielectric layer, the first coil being magnetically coupled to the second coil; and a metal line disposed below and electrically coupled to the first coil in the semiconductor chip, the metal line being magnetically coupled to the second coil. |
地址 |
Neubiberg DE |