Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use

摘要

A heat dissipation structure with aligned carbon nanotube arrays formed on both sides. The carbon nanotube arrays in between a heat source and a cooler are used as thermal interface material extending and dissipating heat directly from a heat source surface to a cooler surface. In some embodiments, an adhesive material can be used to dispense around carbon nanotube arrays and assemble the heat dissipation structure in between a heat source and a cooler. In some other embodiments, carbon nanotube arrays are formed on at least one of a heat source surface and a cooler surface and connect them together by further growing. The carbon nanotube arrays can be exposed to the environment instead of being in between a heat source and a solid cooler, and can serve as fins to enlarge heat dissipation area and improve thermal convection.

主权项

1. A packaged semiconductor structure, comprising:
a heat source; a heat sink; an aligned array of carbon nanotubes comprising a first portion of the carbon nanotubes formed, from a first direction directly on a first surface of the heat source, a second portion of the carbon nanotubes that is different in position from the first portion, formed from a second direction, distinct from the first direction, directly on a second surface of the heat sink, and a third portion of the carbon nanotubes that is different in position from the first portion and the second portion, formed from the first direction directly on the first portion to contact the second portion, wherein a first sidewall of the first portion of the carbon nanotubes and a second sidewall of the second portion of the carbon nanotubes overlap and connect, via the third portion, from the first direction and the second direction to thermally connect the heat source to the heat sink, thereby forming a structural gap between the heat source and the heat sink; and a peripheral connecting adhesive that runs along at least a portion of an outside edge of the structural gap and adheres and permanently bonds a portion of an outside surface of the heat source to outside edges of the first portion of the carbon nanotubes and the second portion of the carbon nanotubes.