Power conversion device

摘要

A power conversion device is provided with a plurality of semiconductor modules. Each semiconductor module includes a heat dissipation member, an insulating substrate, a semiconductor element, an external connection terminal, and a resin portion. The insulating substrate is fixed to the heat dissipation member. The semiconductor element is mounted on the insulating substrate. The external connection terminal includes a first end, which is electrically connected to the semiconductor element, and an opposite second end. The resin portion is molded to the insulating substrate, the semiconductor element, the first end, and at least part of the heat dissipation member. The semiconductor modules each form a unit.

主权项

1. A power conversion device comprising a plurality of semiconductor modules,
each of the semiconductor modules including a heat dissipation member including a heat dissipation portion, an insulating substrate having a lower surface and an upper surface, the lower surface of the insulating substrate being fixed to the heat dissipation member, a semiconductor element mounted on the upper surface of the insulating substrate, an external connection terminal including a first end, which is electrically connected to the semiconductor element, and an opposite second end, and a resin portion molded to the insulating substrate, the semiconductor element, the first end, and at least part of the heat dissipation member, wherein the resin portion covers the insulating substrate, and wherein the semiconductor modules each form a unit.