发明名称 Semiconductor device
摘要 A semiconductor device has a shield plate electrode short-circuited to a source electrode near the drain electrode. The shield plate electrode is connected to the source terminal electrode which has a VIA hole via the first line of air-bridge structure or overlay structure.
申请公布号 US8890263(B2) 申请公布日期 2014.11.18
申请号 US201313776948 申请日期 2013.02.26
申请人 Kabushiki Kaisha Toshiba 发明人 Yamamura Takuji
分类号 H01L29/66;H01L29/417;H01L29/772;H01L29/423;H01L29/78;H01L29/40;H01L29/778;H01L29/16;H01L29/20 主分类号 H01L29/66
代理机构 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A semiconductor device, comprising: a substrate; a gate electrode, which is arranged on a first surface of the substrate and has a plurality of gate finger electrodes; a source electrode, which is arranged on the first surface of the substrate and has a plurality of source finger electrodes, and one of the plurality of source finger electrodes is close to one of the plurality of gate finger electrodes; a drain electrode, which is arranged on the first surface of the substrate and has a plurality of drain finger electrodes, and one of the plurality of drain finger electrodes faces the one of the plurality of source finger electrodes via the one of the plurality of gate finger electrodes; a gate terminal electrode, which is arranged on the first surface of the substrate and is connected to the gate electrode; a source terminal electrode, which is arranged on the first surface of the substrate and is connected to the source electrode; a drain terminal electrode, which is arranged on the first surface of the substrate and is connected to the drain electrode; an insulating layer, which is arranged so as to cover the one of the plurality of gate finger electrodes, the substrate between the one of the plurality of gate finger electrodes and the one of the plurality of source finger electrodes, the substrate between the one of the plurality of gate finger electrodes and the one of the plurality of drain finger electrodes, at least a part of the one of the plurality of source finger electrodes, and at least a part of the one of the plurality of drain finger electrodes; a shield plate electrode, which is arranged via the insulating layer over the one of the plurality of drain finger electrodes and the first surface of the substrate between the one of the plurality of gate finger electrodes and the one of the plurality of drain finger electrodes, is short-circuited to the one of the plurality of source finger electrodes, and shields electrically the one of the plurality of gate finger electrodes and the one of the plurality of drain finger electrodes from each other; a first line, which connects the shield plate electrode and the source terminal electrode by an air-bridge structure or an overlay structure; and a shield plate short circuit line, which short-circuits the shield plate electrode and the one of the plurality of source finger electrodes; wherein the shield plate short circuit line overlaps with the one of the pluralityof gate finger electrodes, and wherein the shield plate short circuit line is arranged via an air gap over the one of the plurality of gate finger electrodes.
地址 Tokyo JP
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