Semiconductor device and method of manufacturing the same

摘要

Provided are a semiconductor device and a method of manufacturing the same. The semiconductor device includes: a memory array on a first substrate; and a peripheral circuit on a second substrate, wherein the first substrate and the second substrate may be attached to each other so that the memory array and the peripheral circuit are electrically connected to each other.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
forming a first memory array on a first substrate; forming a peripheral circuit on a second substrate; wherein the peripheral circuit is for the first memory array, and no memory array is provided on the second substrate; and electrically connecting the first memory array and the peripheral circuit, wherein a surface of the first substrate on which the memory array is formed and a surface of the second substrate on which the peripheral circuit is formed face each other.