| 摘要 |
<p>The present invention provides a solder paste supplying apparatus having an uneven type pressing unit, in which a solder paste is supplied in the contact with an uneven pressing surface, so that the solder paste can be effectively supplied at a constant mixture ratio, and fine bubbles can be effectively prevented. The solder paste supplying apparatus includes a storage container to receive the solder paste therein, and formed in a lower end thereof with a nozzle hole so that the solder paste can be supplied toward a printed circuit board; and a pressing unit including a drying cylinder mounted on an outer lateral side of the storage container to vertically reciprocate toward the solder paste received in the storage container and to apply pressure, and a pressing member which has an upper portion coupled to the driving cylinder so that the pressing member is moved up and down from the driving cylinder, and is placed in the storage container to make surface contact with the solder paste. The pressing member of the pressing unit includes an uneven pressing unit having an uneven part, the pressing surface of the pressing member, which makes contact with the solder paste in opposition to the solder paste, becoming an uneven surface.</p> |
