Apparatus for thinning, testing and singulating a semiconductor wafer

摘要

A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator acts as a mechanical support during a thinning process as well as during a wafer dicing operation. The singulated integrated circuits are then removed from the wafer translator. In some embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer thinning process but before the wafer and wafer translator are separated. In other embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer dicing operation but before the diced wafer and wafer translator are separated.

主权项

1. An apparatus for wafer testing, comprising:
a wafer translator having a wafer-side facing a wafer and an inquiry-side facing away from the wafer, the wafer-side carrying contact structures corresponding to pads on dies of the wafer; and a releasable adhesive material at the wafer-side of the wafer translator, wherein the adhesive material includes a plurality of openings positioned to expose a corresponding plurality of contact structures, wherein the releasable adhesive material is in a state that is optimized for (a) temporary holding of the wafer and (b) ability to attain another state characterized by ease of removal of the dies from the adhesive.