| 发明名称 | Metal injection molded heat dissipation device | ||
| 摘要 | A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader. | ||
| 申请公布号 | US8889489(B2) | 申请公布日期 | 2014.11.18 |
| 申请号 | US201213586028 | 申请日期 | 2012.08.15 |
| 申请人 | Intel Corporation | 发明人 | Stanley Gavin D.;Crocker Michael T. |
| 分类号 | H01L23/34;H05K7/20;H01L23/473;H01L23/373;F28F13/00 | 主分类号 | H01L23/34 |
| 代理机构 | International IP Law Group, P.C. | 代理人 | International IP Law Group, P.C. |
| 主权项 | 1. A base plate for dissipating heat wherein the base plate is a metal injection molded plate, and the base plate comprises a plurality of conducting pellets. | ||
| 地址 | Santa Clara CA US | ||