MEMS pressure transducer assembly and method of packaging same

摘要

An assembly (20) includes a MEMS die (22) having a pressure transducer device (40) formed on a substrate (44) and a cap layer (38). A packaging process (74) entails forming the device (40) on the substrate, creating an aperture (70) through a back side (58) of the substrate (44) underlying a diaphragm (46) of the device (40), and coupling a cap layer (38) to the front side of the substrate (44) overlying the device (40). A trench (54) is produced extending through both the cap layer (38) and the substrate (44), and surrounds a cantilevered platform (48) at which the diaphragm (46) resides. The die (22) is suspended above a substrate (26) so that a clearance space (60) is formed between the platform (48) and the substrate (26). The diaphragm (46) is exposed to an external environment (68) via the aperture (70) and the space (60), and an external port.

主权项

1. A method of making a microelectromechanical systems (MEMS) device package comprising:
forming a MEMS device on a front side of a device substrate; removing a portion of said device substrate to form an aperture extending through said device substrate underlying an active region of said MEMS device; coupling a cap layer to said front side of said device substrate overlying said MEMS device; and removing a section of each of said cap layer and said device substrate partially surrounding said MEMS device to form a cantilevered platform at which said active region resides, wherein at least a portion of said cap layer is attached to said cantilevered platform to form a sealed cavity in which said active region is located.