Optimizing lithographic processes using laser annealing techniques

摘要

Approaches for utilizing laser annealing to optimize lithographic processes such as directed self assembly (DSA) are provided. Under a typical approach, a substrate (e.g., a wafer) will be subjected to a lithographic process (e.g., having a set of stages/phases, aspects, etc.) such as DSA. Before or during such process, a set of laser annealing passes/scans will be made over the substrate to optimize one or more of the stages. In addition, the substrate could be subjected to additional processes such as hotplate annealing, etc. Still yet, in making a series of laser annealing passes, the techniques utilized and/or beam characteristics of each pass could be varied to further optimize the results.

主权项

1. A method for optimizing a lithographic process, comprising:
subjecting a substrate to a lithographic process having a set of stages, the lithographic process comprising a directed self assembly (DSA) process; and applying a set of laser annealing passes to the substrate to optimize at least one of the set of stages, the set of laser annealing passes comprising:
a first laser annealing pass to optimize a phase separation stage of the DSA process; anda second laser annealing pass to facilitate a set of chemical reactions occurring pursuant to the DSA process,wherein the first laser annealing pass is applied via a first technique and the second laser annealing pass is applied via a second technique.