Method for manufacturing semiconductor package

摘要

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor element, a package body and a conductive part. The substrate has an electrical contact. The semiconductor element is disposed on the substrate. The package body covers the semiconductor element and defines a through hole from which the electrical contact is exposed. Wherein, the package body includes a resin body and a plurality of fiber layers. The fiber layers are disposed in the resin body and define a plurality of fiber apertures which is arranged as an array. The conductive part is electrically connected to the substrate through the through hole.

主权项

1. A method for manufacturing semiconductor package, comprising:
providing a substrate having an electrical contact; disposing a semiconductor element on the substrate; forming a conductive part on the electrical contact; stacking a plurality of resin layers and a plurality of fiber layers on the substrate, wherein the semiconductor element is exposed from the resin layers and the fiber layers, and each fiber layer defines a plurality of fiber apertures arranged as an array; applying a pressure and a heat to the resin layers and the fiber layers to melt the resin layers, wherein the melted resin layers solidify as a resin body, and the resin body and the fiber layers form a package body; forming a through hole passing through the resin body and the fiber layers to expose the conductive part; and singulating the substrate and the package body.