Apparatus and method for a component package

摘要

A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features formed on the surfaces of the respective interposers. A plurality of through vias may provide for electrically connecting the interposers to one another. A first interposer may provide for electrical connections to a printed circuit board or subsequent semiconductor device. A second interposer may provide for electrical connections to a second semiconductor device and a second component package. The first and second component packages may be combined to form a Package-on-Package (“PoP”) structure.

主权项

1. A method, comprising:
forming a first metal layer on a first carrier; forming a plurality of conductive pillars on the first metal layer; attaching a first side of a first semiconductor device to the first metal layer; encapsulating the first semiconductor device and the plurality of conductive pillars; forming a first redistribution layer (RDL) on a second side of the first semiconductor device, wherein the first RDL is electrically coupled to the conductive pillars and the first semiconductor device; attaching a second carrier to the first RDL; removing the first carrier and the first metal layer; and forming a second RDL on the first side of the first semiconductor device to form a first packaging component, the second RDL electrically coupled to the plurality of conductive pillars.