Methods to fabricate integrated circuits by assembling components

摘要

The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. The present process can fabricate multiple components separately before assembling them into a complete integrated circuit. In an aspect, the ready-for-assembling components are taken directly from processed wafers without any additional assembling processes, and/or having lateral dimensions less than 1 mm.

主权项

1. A method for fabricating an integrated circuit, the method comprising:
separating the integrated circuit into multiple functional components; and fabricating the multiple functional components on separate substrates so that the functional components are not in contact with each other when the fabrication is completed, wherein each functional component has bond pads for connection with other functional component, and wherein at least one functional component, when ready for assembling into a complete integrated circuit, has a lateral dimension less than 0.5 mm and a thickness less than 100 microns.