LED projection lamp having a cylindrical heat sink

摘要

A LED projection lamp includes a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component. The heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear. The lamp cup is arranged inside the trumpet-shaped inner cavity and the LED module is disposed on a small opening portion of the lamp cup. The lens is used by the LED module for light transmission, the first heat conduction component includes a first vapor chamber, the fastening device is sleeved at the rear end of the cylindrical inner cavity, and the second heat conduction component includes a second vapor chamber.

主权项

1. An LED projection lamp, comprising:
a heat sink, in which the heat sink being cylindrical; a heat dissipation structure arranged on the cylindrical periphery of the heat sink; and a trumpet-shaped inner cavity gradually expanded from inside to outside formed at the front end of a cylindrical inner cavity of the heat sink; a lamp cup, in which the lamp cup taking the shape of a trumpet matched with the trumpet-shaped inner cavity of the heat sink and having a large opening portion and a small opening portion; the large opening portion clamped on the outer edge at the front end of the heat sink; and the small opening portion disposed in the inner cavity of the heat sink; an LED module, in which the LED module formed by a plurality of LED chips packaged on an aluminum nitride ceramic wafer and disposed on the small opening portion of the lamp cup; a lens, in which the lens used by the LED module for light transmission and fixed at the front end of the heat sink through a retainer ring; a first heat conduction component, in which the first heat conduction component comprising a first vapor chamber bent to form a smoothing section and two symmetrical sections symmetrically disposed on both sides of the smoothing section; the LED module fixed on the front of the smoothing section of the first vapor chamber; the two symmetrical sections of the first vapor chamber extended to the vicinity of the large opening portion from the small opening portion of the lamp cup; inner side faces of the two symmetrical sections of the first vapor chamber being cambered surfaces and adhered to the outerwall of the lamp cup; and outer side faces of the two symmetrical sections of the first vapor chamber being cambered surfaces and adhered to the wall of the trumpet-shaped inner cavity of the heat sink; a fastening device, in which the fastening device being cylindrical and sleeved at the rear end of the cylindrical inner cavity of the heat sink; a second heat conduction component, in which the second heat conduction component comprising a second vapor chamber bent to form a smoothing section and two symmetrical sections symmetrically disposed on both sides of the smoothing section; the smoothing section of the second vapor chamber supported and fixed by a mounting plate; the two symmetrical sections of the second vapor chamber sleeved outside the fastening device; inner side faces of the two symmetrical sections of the second vapor chamber being cambered surfaces and adhered to the outerwall of the fastening device; and outer side faces of the two symmetrical sections of the second vapor chamber being cambered surfaces and adhered to the wall of the cylindrical inner cavity of the heat sink; and the mounting plate, in which the mounting plate disposed on the smoothing section of the first vapor chamber; and the first vapor chamber and the second vapor chamber supported and fixed by the mounting plate; wherein the total radiating power of the first and second heat conduction components being more than or equal to the power produced by the LED module; and the heat conduction path being as follows: the heat directly conducted from the LED chips to the aluminum nitride ceramic wafer first, then directly conducted to the vapor chambers, finally conducted to heat pipes, an inner radiator and an outer radiator, and dispersed by fin devices of the radiators via cross-ventilation and radiation, in which the aluminum nitride ceramic wafer, the vapor chambers and the heat pipes being all heat conducting media with low thermal resistance.