发明名称 Impedance matching method
摘要 A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.
申请公布号 US8887385(B2) 申请公布日期 2014.11.18
申请号 US201213534217 申请日期 2012.06.27
申请人 Hon Hai Precision Industry Co., Ltd. 发明人 Wu Kai-Wen
分类号 H05K3/02 主分类号 H05K3/02
代理机构 Novak Druce Connolly Bove + Quigg LLP 代理人 Novak Druce Connolly Bove + Quigg LLP
主权项 1. An impedance matching method for impedance matching between a pad and a connection line, the method comprising: providing a circuit board and the pad, the pad having a predetermine thickness and having a predetermine horizontal cross-section area such that the pad having a predetermined resistance value; forming the pad on the circuit board; fabricating the connection line, by controlling a length and a horizontal cross-section area of the connection line to make the connection line have the same predetermined resistance value as the pad; and connecting a connection end of the connection line to the pad.
地址 New Taipei TW