发明名称 |
Impedance matching method |
摘要 |
A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad. |
申请公布号 |
US8887385(B2) |
申请公布日期 |
2014.11.18 |
申请号 |
US201213534217 |
申请日期 |
2012.06.27 |
申请人 |
Hon Hai Precision Industry Co., Ltd. |
发明人 |
Wu Kai-Wen |
分类号 |
H05K3/02 |
主分类号 |
H05K3/02 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. An impedance matching method for impedance matching between a pad and a connection line, the method comprising:
providing a circuit board and the pad, the pad having a predetermine thickness and having a predetermine horizontal cross-section area such that the pad having a predetermined resistance value; forming the pad on the circuit board; fabricating the connection line, by controlling a length and a horizontal cross-section area of the connection line to make the connection line have the same predetermined resistance value as the pad; and connecting a connection end of the connection line to the pad. |
地址 |
New Taipei TW |