发明名称 THERMOSETTING RESIN COMPOSITION AND NEAR-INFRARED CUT FILTER
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin composition that can be used to manufacture a near-infrared cut filter having high heat resistance and to provide a near-infrared cut filter having high heat resistance manufactured by using the resin composition, particularly, a near-infrared cut filter for an image pickup element such as CCD, CMOS or the like.SOLUTION: A curable resin composition comprises an epoxy resin, a curing agent for epoxy resin and a near-infrared ray absorbing dyestuff. An epoxy resin having a silicone skeleton produced by reacting, with water, a modified silicone oil produced by condensation of a silanol-terminated silicone oil and an epoxy group-containing silicon compound is used as the epoxy resin.</p>
申请公布号 JP2014214262(A) 申请公布日期 2014.11.17
申请号 JP20130094070 申请日期 2013.04.26
申请人 NIPPON KAYAKU CO LTD 发明人 NIIMI KAZUKI;MIYAGAWA NAOFUSA;MORITA RYOTARO
分类号 C08G59/30;C08G59/40;C08G77/42;C08L63/00;C09B23/00;G02B5/22 主分类号 C08G59/30
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