| 摘要 |
<p>Disclosed herein is a method of manufacturing a rigid flexible printed circuit board, including: preparing a flexible substrate having an inner layer circuit pattern formed on one surface or both surfaces thereof and divided into a rigid region and a flexible region; forming a protective layer in the flexible region of the flexible substrate; forming a coverlay so as to expose the protective layer on one surface of the flexible substrate; stacking a rigid insulating layer in the rigid region and stacking a metal layer in the protective layer and the rigid insulating layer; forming an outer layer circuit layer by patterning the metal layer and removing the metal layer in the flexible region; and removing the protective layer.</p> |
