| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide new solder alloy capable of suppressing occurrence of a soldering defective state called as a solder ball when soldering by using solder paste.SOLUTION: Solder alloy contains: Sn; at least any one of Ag, Bi, Sb and Cu; and In of less than 0.100 wt%.</p> |
