| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance the image quality of a captured image.SOLUTION: A solid state imaging device 1 includes a semiconductor chip 2 having an imaging region 2a, a wiring board 3 having an aperture 3a in a region facing the imaging region 2a, provided with an antireflection part 8 on the end face of the aperture 3a, and bonded to the surface of the semiconductor chip 2 on the imaging region 2a side, and a translucent plate 4 bonded to the surface of the semiconductor chip 2 on the side opposite from the semiconductor chip 2 so as to close the aperture 3a.</p> |
