发明名称 |
SILVER-BISMUTH POWDER, CONDUCTIVE PASTE AND CONDUCTIVE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a silver-bismuth powder which has good solder wettability and a low volume resistivity and exerts excellent conductivity even in applications involving baking in a relatively high-temperature oxidative atmosphere (500°C or higher), a conductive paste and a conductive film.SOLUTION: A silver-bismuth powder comprises silver and bismuth in a mass ratio of silver to bismuth, silver:bismuth, of 95:5 to 40:60 and has an accumulation 50% particle size (D50) in the distribution of volume-based particle sizes of 0.1-10 μm, measured by the laser diffraction type particle size distribution measurement method, and an oxygen content of 5.5 mass% or lower. |
申请公布号 |
JP2014214340(A) |
申请公布日期 |
2014.11.17 |
申请号 |
JP20130092094 |
申请日期 |
2013.04.25 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
OGI KOZO;INOUE KENICHI;EBARA ATSUSHI;ASANO AKIHIRO;FUJIMOTO HIDEYUKI;YAMADA TAKEHIRO |
分类号 |
B22F1/00;B22F7/04;B22F9/00;B22F9/08;C22C5/06;C22C12/00;H01B1/00;H01B1/02;H01B1/22;H01B5/00;H01B5/14;H05K1/09 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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