发明名称 SILVER-BISMUTH POWDER, CONDUCTIVE PASTE AND CONDUCTIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a silver-bismuth powder which has good solder wettability and a low volume resistivity and exerts excellent conductivity even in applications involving baking in a relatively high-temperature oxidative atmosphere (500°C or higher), a conductive paste and a conductive film.SOLUTION: A silver-bismuth powder comprises silver and bismuth in a mass ratio of silver to bismuth, silver:bismuth, of 95:5 to 40:60 and has an accumulation 50% particle size (D50) in the distribution of volume-based particle sizes of 0.1-10 μm, measured by the laser diffraction type particle size distribution measurement method, and an oxygen content of 5.5 mass% or lower.
申请公布号 JP2014214340(A) 申请公布日期 2014.11.17
申请号 JP20130092094 申请日期 2013.04.25
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 OGI KOZO;INOUE KENICHI;EBARA ATSUSHI;ASANO AKIHIRO;FUJIMOTO HIDEYUKI;YAMADA TAKEHIRO
分类号 B22F1/00;B22F7/04;B22F9/00;B22F9/08;C22C5/06;C22C12/00;H01B1/00;H01B1/02;H01B1/22;H01B5/00;H01B5/14;H05K1/09 主分类号 B22F1/00
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