发明名称 MULTIPLE PIECE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multiple piece wiring board that suppresses a crack and such when divided into individual pieces of a wiring board.SOLUTION: The multiple piece wiring board includes: a surface layer part 1a composed of ceramics; and a metal dummy pattern 3 provided at a respective edge region 2a of a plurality of a wiring board region 2 of the surface layer part 1a. The metal dummy pattern 3 makes it possible to relax a stress when being divided into individual pieces of the wiring board and suppress generation of a crack.
申请公布号 JP2014216548(A) 申请公布日期 2014.11.17
申请号 JP20130094037 申请日期 2013.04.26
申请人 KYOCERA CORP 发明人 YAMAMOTO SHUICHI
分类号 H05K1/02;H01L23/13 主分类号 H05K1/02
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