发明名称 JET STATE EVALUATION DEVICE OF MOLTEN SOLDER
摘要 <p>PROBLEM TO BE SOLVED: To configure a jet state evaluation device inexpensively, and to evaluate the jet state of molten solder accurately by using the jet state evaluation device.SOLUTION: When soldering an electronic component to a printed wiring board 3, molten solder 2 is jetted from a nozzle 1. A jet state evaluation device evaluates the jet state of molten solder 2. The jet state evaluation device includes an evaluation plate 5. The evaluation plate 5 has a back surface 5b formed flatly, and at least three through holes 7 are formed to penetrate from the front surface 5a to the back surface 5b. When viewing the evaluation plate 5 from the front surface 5a side, the through holes 7 are arranged side by side in a straight line.</p>
申请公布号 JP2014216390(A) 申请公布日期 2014.11.17
申请号 JP20130090646 申请日期 2013.04.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJIMA YOSHIKO;KAWABATA RYOHEI
分类号 H05K3/34;B23K1/00;B23K1/08 主分类号 H05K3/34
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