| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface plasmon sensor solving a problem in a thin metallic film material for excitation of surface plasmon, for which Au, Ag or Cu has been considered to be an advantageous material, while Au or Ag is expensive and Cu is considered to be difficult to use in view of stability, as being generally problematic in diffusivity, oxidizability, adhesion property, and crystallinity.SOLUTION: In a plasmon sensor, Cu, being less expensive than Au or Ag, is used as a thin metallic film material for generating surface plasmon. A thin film made of a nitride of Ta or a nitrooxide is formed on a substrate within a range of an appropriate film thickness, making contact with an upper side and a lower side of a Cu film. |
