| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure which improves work efficiency during assembly and implements equal heat dissipation effects, and an assembly method of the heat dissipation structure.SOLUTION: Two power transistors adjacently mounted on a circuit board are defined as one couple, the circuit board includes through holes at both sides of a position where the power transistor couple is mounted, and a fixing member includes protrusions at positions corresponding to the through holes of the circuit board. The circuit board includes a screw through hole between the positions where two power transistors forming a couple are mounted. The protrusions of the fixing member are inserted into the through holes of the circuit board and a heat sink and the fixing member are fixed by a screw penetrating the screw through hole of the circuit board, such that the power transistors are pressed and fixed between the circuit board and the heat sink. |
