| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a core substrate of a multilayer lamination wiring board, providing both micro pattern formation and high connection reliability.SOLUTION: A method of manufacturing a core substrate 40 of a multilayer lamination wiring board, includes a step for forming copper foil patterns by etching copper foils on front and rear surfaces of the core substrate 40, a step for forming connection holes 20 for electrical connection of the copper foil patterns on the front and rear surfaces of the core substrate 40 by removing an insulating resin layer 11 exposed in the step for forming the copper foil pattern, and a step for removing resin residue 17 and copper residue 18 generated at bottom parts of the connection holes 20 in the step for forming the connection holes 20. In the method of manufacturing the core substrate 40 of the multilayer lamination wiring board, laser is used as a means for removing the insulating resin layer 11, in the step for forming the connection holes 20, and spray cleaning is adopted as a means for removing the copper residue 18.</p> |
