| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic device capable of enhancing heat radiation property of a heat generation element through a heat radiation fin, and to provide a method of manufacturing the same.SOLUTION: In a circuit board 20 for mounting semiconductor elements 23 and 24 on one side mounting surface 21, a first through hole 27 passing therethrough from the one side mounting surface 21 to the other side mounting surface 22 is formed. In a base 31 of a heat radiation fin 30, a second through hole 35 is formed, which passes therethrough from a heat receiving side surface 33 to a heat radiation side surface 34 and communicates with the first through hole 27 when the other side mounting surface 22 and the heat receiving side surface 33 are thermally connected. A molding resin 40 for molding (encapsulating) the circuit board 20 and the heat radiation fin 30 except for a plurality of fin parts 32 and a part of the heat radiation side surface 34, is formed to fill the first through hole 27 and the second through hole 35, which are communicated in a state that the other side mounting surface 22 of the circuit board 20 and the heat receiving side surface 33 of the base 31 are thermally connected. The molding resin 40 is also formed to cover the heat radiation side surface 34 configuring an outer edge of the second through hole 35 by a slip-off prevention part 41.</p> |
