MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To suppress short circuit between interconnections due to voids generated between inner layer interconnections, in a multilayer board produced by laminating a build-up layer, consisting of a prepreg, on the outer surface of a core layer as an insulation layer, and then sealing a plurality of inner layer interconnections provided on the outer surface with resin of the build-up layer.SOLUTION: The part positioned between a plurality of inner layer interconnections 51, 52, out of the front and back surfaces 20a, 20b of a core layer 20, are uneven surfaces 21a, 21b having a surface roughness larger than that of a part where the plurality of inner layer interconnections 51, 52 are positioned.