| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent cracks from occurring on a metal oxide layer of a heat radiation substrate and improve the electrical reliability of a package for storing an electronic component and an electronic device.SOLUTION: A heat radiation substrate 4 of the invention includes: a substrate 8 mainly composed of carbon; a metal layer 9 which is provided on an upper surface of the substrate 8 and has a thermal expansion coefficient larger than a thermal expansion coefficient of the substrate 8; and a metal oxide layer 10 which is formed by oxidizing an upper surface of the metal layer 9 and has an electronic component mounting region electrically insulated from the metal layer 9 on its upper surface. The structure prevents cracks from occurring on the metal oxide layer 10 of the heat radiation substrate 4 and improves the electric reliability of a package for storing the electronic component and an electronic device which use the heat radiation substrate 4.</p> |
