发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component and a board for mounting the same.SOLUTION: The multilayer ceramic electronic component includes: a ceramic body which includes a plurality of dielectric layers laminated in thickness direction and satisfies T/W>1.0, where W is the width of the ceramic body and T is the thickness thereof, and which includes a longitudinal groove part recessed inward on at least one main surface; a plurality of first and second internal electrodes which are arranged to face each other through the dielectric layer in the ceramic body and exposed alternately from both end surfaces of the ceramic body; and first and second external electrodes which are formed from both end surfaces of the ceramic body to one main surface where the groove part is formed, and which are connected electrically to the first and second internal electrodes respectively.
申请公布号 JP2014216643(A) 申请公布日期 2014.11.17
申请号 JP20130234089 申请日期 2013.11.12
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 HAN BYUNG WOO;ONO MASAAKI;CHOI JAE YEOL;KIM SANG HUK
分类号 H01G4/12;H01G2/06;H01G4/30 主分类号 H01G4/12
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