| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can inhibit poor connection.SOLUTION: A semiconductor device of an embodiment comprises: a package substrate 21; a printed wiring board 11; a restriction pin 42 which pierces the printed wiring board 11 and the package substrate 21 to restrict deformation in a direction in which the printed wiring board 11 and the package substrate 21 separated from each other; a standoff 43 provided between the printed wiring board 11 and the package substrate 21 to restrict deformation in a direction in which the printed wiring board 11 and the package substrate 21 come closer to each other. The restriction pin 42 includes a head 42a which contacts a surface 14 of the printed wiring board 11 on the side separated from the package substrate 21, a hook part 42c which is openable and closable in a direction parallel with a surface 24 of the package substrate 21 on the side separated from the printed wiring board 11 and hooked into the surface 24, and a spring part 42b for connecting the head 42a and the hook part 42c. |
