| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of hardly generating a conventional large narrowing part in a through-hole, when forming the though-hole in a glass substrate by laser beam irradiation.SOLUTION: The method for forming the though-hole in the glass substrate, comprises (a) a process of irradiating a laser beam to the glass substrate, thereby, the process of forming the though-hole having the narrowing part by forming the though-hole of reaching a second surface from a first surface in an irradiation area of the glass substrate and (b) a process of generating electric discharge via the though-hole by impressing DC voltage between the first surface and the second surface of the glass substrate, thereby, the process of expanding an opening dimension of a cross section in the substantially vertical direction to the drawing axis of the through-hole in the narrowing part of the through-hole. |
