| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bonding structure of a diaphragm for a micro speaker.SOLUTION: The present invention provides a bonding structure of a diaphragm for a micro speaker. The bonding structure includes: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are bonded to the central portion and the outer peripheral portion of the suspension, respectively, and a dome portion which is projected between the inner peripheral portion and the outer peripheral portion. The suspension and the side diaphragm are bonded by thermal compression.</p> |
