INSULATING RESIN COMPOSITION FOR PRINTED WIRING BOARD WITH LOW THERMAL EXPANSION AND HIGH THERMOSTABILITY, AND PREPREG, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD THAT USE THE SAME

摘要

PROBLEM TO BE SOLVED: To provide: an insulating resin composition for a printed wiring board with low thermal expansion and high thermostability; and a prepreg, a copper-clad laminate and a printed wiring board that use the composition.SOLUTION: The insulating resin composition for a printed wiring board comprises an epoxy resin, an inorganic filler, a liquid crystal oligomer, and a BPA novolac resin hardener represented by the chemical formula 1 in the figure or an aminotriazine phenol hardener.