| 摘要 |
PROBLEM TO BE SOLVED: To provide dry silica fine particles suitably used for abrasive grains of abrasive in semiconductor applications or an additive of a resin composition for adhesion and seal, having a BET specific surface area of 60-170 m/g and having excellent dispersibility, narrow particle size distribution of the dispersed particles and small primary aggregate, and to provide an aqueous dispersion and a resin composition containing the dry silica fine particles.SOLUTION: The dry silica fine particles suitably used for abrasive grains of abrasive in semiconductor applications or an additive of a resin composition for adhesion and seal has (A) a BET specific surface area of 60 m/g or more and 170 m/g or less, (B) 90 nm or less of the median size of a weight standard particle size distribution obtained by a centrifugal sedimentation method, (C) 1.40 or less of the geometric standard deviation &sgr;g of the weight standard particle size distribution obtained by the centrifugal sedimentation method and (D) 0.011 g/mor less of a DBP oil absorption amount per 1 m. |
